COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. F31
- Cpu Description: Qualcomm® Dragonwing™ IQ-X Series of processors in SiP-A (12 OR 8 CORE)
- Memory: Up to 64GB LPDDR5 4224MT/s integrated on SiP
- Graphics: Qualcomm® Adreno™ GPU:
- Video Interfaces: Up to 4 independent displays.
- Mass Storage: UFS 4.0 module on-board, I2C EEPROM
- Power Supply: +12VDC ± 10%, +5V StandBy, +3.0VRTC
- Operating System: Microsoft® Windows 11 IoT Enterprise / Yocto Linux
- Operating Temperature 0° ÷ +60°C (Commercial Version) -40C ÷ +85°C (Industrial Version)
- Dimensions 95x95mm (COM Express Compact Form Factor)
